Product introduction
inSync創(chuàng)造性的開(kāi)發(fā)了MEMS微鏡陣列芯片的核心技術(shù)，能實(shí)現(xiàn)大孔徑(將目前市場(chǎng)上最大孔徑面積提升~10倍, 可大幅提高LiDAR等光學(xué)掃描性能), 又能保留MEMS高集成度、低成本的優(yōu)勢(shì)，還能在可靠性方面通過(guò)車規(guī)級(jí)AEC-Q100標(biāo)準(zhǔn)(抗沖擊性能優(yōu)于同類產(chǎn)品~20倍)的掃描器技術(shù)。
Product advantages
MEMS Mirror Array （MMA） technology enables vivid, crisp light scanning quality forLiDAR/HUD/Medical/AR applications.
InSync 1D-MEMS with bar laser and detector or hybrid-2D MEMS can significantly optimize LiDAR system architecture and simplify optical -mechanical system，to reduce the module size, to generate a unified point cloud, and also improve the system reliability.
Our products can help to improve LiDAR scanning performance, such as points cloud, resolution, detection range with the large optical aperture and FoV, and dramatically cost down at the same time.
With the MEMS array design, we are able to customized FoV/Freq./Size/packaging MEMS mirrors very quickly. Also, we offer ample support resources such as evaluation kits, reference designs, software and on-site support to ease your design process.
Technological Innovation
Micro machined mirror array with innovated synchronous resonance technology to achieve super Large optical aperture for LiDAR/HUD/AR application.
Adopting integrated electrostatic driving technology to achieve precise scanning, integrated driving, and simple external interface.
The temperature can be compensated by the drive and sense comb structure, furthuremore, the scanning angle canbe detected and calculated by the capacitor sensing. The innovated functionality reduce external temperature compensation and angle detection circuit.
The designed large-area bottom silicon substrate structure is perfect conducive material for rapid heat dissipation, with good heat dissipation effect, making the MEMS mirror capable of high-power laser irradiation.
Product list
| 型號(hào) | 圖片 | 光學(xué)孔徑面積mm2 | 封裝尺寸mm | 諧振頻率Hz | 偏轉(zhuǎn)角° | 車規(guī)AEC-Q | 抗沖擊性 |
|---|---|---|---|---|---|---|---|
| A290（點(diǎn)擊下載規(guī)格書(shū)） |  |
290 | 29.2 * 29.2 * 3 | 2K | ±7.5 | Full compliance | >1500G |
| A150（點(diǎn)擊下載規(guī)格書(shū)） |  |
150 | 27.8 * 13.4 * 3.25 | 2K | ±12.5 | Full compliance | >1500G |
| A18 （投影顯示應(yīng)用） |  |
18 | 10.8 *6* 2.25 | 20K | ±12.5 | Full compliance | >1500G |
Technical overview
inSync創(chuàng)造性的開(kāi)發(fā)了MEMS微鏡陣列芯片的核心技術(shù)，是業(yè)內(nèi)唯一既能實(shí)現(xiàn)大孔徑(將目前市場(chǎng)上最大孔徑面積提升~10倍, 可大幅提高LiDAR等光學(xué)掃描性能), 又能保留MEMS高集成度、低成本的優(yōu)勢(shì)，還能在可靠性方面通過(guò)車規(guī)級(jí)AEC-Q100標(biāo)準(zhǔn)(抗沖擊性能優(yōu)于同類產(chǎn)品~20倍)的掃描器技術(shù)。
inSync（上海映芯諧振機(jī)電科技有限公司）是一家從事車規(guī)級(jí)MEMS器件研發(fā)設(shè)計(jì)、制造及產(chǎn)業(yè)化應(yīng)用的芯片企業(yè)。
了解詳情備案號(hào)碼：滬ICP備2023016714號(hào)
